NXP Semiconductors MRFE6VP100HR5
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| Attribute | Value |
|---|---|
| HTS | 8541.29.00.55 |
| PPAP | No |
| SVHC | Yes |
| EU RoHS | Compliant |
| Mounting | Screw |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 5 |
| Automotive | No |
| PCB changed | 5 |
| Availability | No Stock Available |
| Channel Mode | Enhancement |
| Channel Type | N |
| Maximum VSWR | 65(Min) |
| Configuration | Dual Common Source |
| Package Width | 9.91(Max) |
| Package Height | 4.32(Max) |
| Package Length | 34.16(Max) |
| Supplier Package | Case 465M-01 |
| Maximum IDSS (uA) | 10 |
| Mode of Operation | 2-Tone|CW |
| Manufacturer Lead Time | 99 weeks |
| Maximum Frequency (MHz) | 2000 |
| Minimum Frequency (MHz) | 1.8 |
| Typical Power Gain (dB) | 19|27.2 |
| Maximum Output Power (W) | 100(Typ) |
| Number of Elements per Chip | 2 |
| Typical Drain Efficiency (%) | 70 |
| Maximum Gate-Source Voltage (V) | 10 |
| Maximum Drain-Source Voltage (V) | 133 |
| Maximum Gate Threshold Voltage (V) | 2.6 |
| Maximum Operating Temperature (°C) | 225 |
| Minimum Operating Temperature (°C) | -40 |
| Typical Input Capacitance @ Vds (pF) | 73.6@50V |
| Typical Output Capacitance @ Vds (pF) | 23.9@50V |
| Maximum Gate-Source Leakage Current (nA) | 400 |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 0.24@50V |
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Packaging Process
