NXP Semiconductors MRF8P20160HSR3
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| Attribute | Value |
|---|---|
| HTS | COMPONENTS |
| PPAP | No |
| SVHC | Yes |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 5 |
| Automotive | No |
| PCB changed | 5 |
| Availability | No Stock Available |
| Channel Mode | Enhancement |
| Channel Type | N |
| Maximum VSWR | 10 |
| Configuration | Dual Common Source |
| Package Width | 9.91(Max) |
| Package Height | 4.32(Max) |
| Package Length | 20.7(Max) |
| Supplier Package | Case 465H-02 |
| Mode of Operation | 1-Carrier W-CDMA |
| Maximum Frequency (MHz) | 2025 |
| Minimum Frequency (MHz) | 1880 |
| Typical Power Gain (dB) | 16.5 |
| Maximum Output Power (W) | 37(Typ) |
| Number of Elements per Chip | 2 |
| Typical Drain Efficiency (%) | 45.8 |
| Maximum Gate-Source Voltage (V) | 10 |
| Maximum Drain-Source Voltage (V) | 65 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -65 |
Purchase & Inquiry
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Packaging Process
