10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors MPC859TZP133A

NXP Semiconductors MPC859TZP133A electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
MPC859TZP133A
Date Code
1102
Quantity
451
Availability
In Stock
Package
BGA
Packaging
Tray
Description
MPU PowerQUICC MPC8xx Processor RISC 32bit 133MHz 3.3V 357-Pin BGA Tray
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
CAN
0
HTS
8542.31.00.50
I2C
1
I2S
0
SPI
1
USB
0
PPAP
No
SVHC
Yes
UART
2
USART
0
EU RoHS
Not Compliant
Ethernet
0
Mounting
Surface Mount
ECCN (US)
3A991a.2.
Packaging
Tray
Pin Count
357
Automotive
No
Lead Shape
Ball
Device Core
MPC8xx
Family Name
PowerQUICC MPC8xx Processor
PCB changed
357
Availability
No Stock Available
Package Width
25
Ethernet Speed
10Mbps/100Mbps
Interface Type
I2C/SPI/UART
On-Chip Memory
8KB/RAM
Package Height
1.82(Max)
Package Length
25
Data Cache Size
4KB
I/O Voltage (V)
3.3
Supplier Package
BGA
Maximum Speed (MHz)
133
Multiply Accumulate
No
Number of CPU Cores
1
Data Bus Width (bit)
32
Standard Package Name
BGA
Instruction Cache Size
4KB
SVHC Exceeds Threshold
Yes
Instruction Set Architecture
RISC
Maximum Power Dissipation (mW)
320
Maximum Operating Temperature (°C)
95
Minimum Operating Temperature (°C)
0
Maximum Operating Supply Voltage (V)
1.9|3.465
Minimum Operating Supply Voltage (V)
1.7|3.135
Typical Operating Supply Voltage (V)
1.8|3.3
AttributeValue
CAN0
HTS8542.31.00.50
I2C1
I2S0
SPI1
USB0
PPAPNo
SVHCYes
UART2
USART0
EU RoHSNot Compliant
Ethernet0
MountingSurface Mount
ECCN (US)3A991a.2.
PackagingTray
Pin Count357
AutomotiveNo
Lead ShapeBall
Device CoreMPC8xx
Family NamePowerQUICC MPC8xx Processor
PCB changed357
AvailabilityNo Stock Available
Package Width25
Ethernet Speed10Mbps/100Mbps
Interface TypeI2C/SPI/UART
On-Chip Memory8KB/RAM
Package Height1.82(Max)
Package Length25
Data Cache Size4KB
I/O Voltage (V)3.3
Supplier PackageBGA
Maximum Speed (MHz)133
Multiply AccumulateNo
Number of CPU Cores1
Data Bus Width (bit)32
Standard Package NameBGA
Instruction Cache Size4KB
SVHC Exceeds ThresholdYes
Instruction Set ArchitectureRISC
Maximum Power Dissipation (mW)320
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9|3.465
Minimum Operating Supply Voltage (V)1.7|3.135
Typical Operating Supply Voltage (V)1.8|3.3

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Packaging Process