10-13 NOV 2026 · Munich, Germany

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NXP Semiconductors MC34GD3000EP

NXP Semiconductors MC34GD3000EP electronic component product image

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Manufacturer
Manufacturer No
MC34GD3000EP
Availability
In Stock
Package
56-VFQFN Exposed Pad
Packaging
Bulk
Description
GD3000 - Brushless DC Motor Gate
Detailed Description
Multiphase Motor Driver Power MOSFET SPI 56-QFN (8x8)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Grade
Automotive
Series
-
Function
Controller - Commutation, Direction Management
Interface
SPI
Packaging
Bulk
Technology
Power MOSFET
Applications
General Purpose
Manufacturer
NXP Semiconductors
Mounting Type
Surface Mount
Qualification
AEC-Q100
Package / Case
56-VFQFN Exposed Pad
Voltage - Load
6V ~ 58V
Step Resolution
-
Current - Output
-
Voltage - Supply
6V ~ 58V
Motor Type - AC, DC
Brushless DC (BLDC)
Motor Type - Stepper
Multiphase
Output Configuration
Half Bridge (3)
Operating Temperature
-20°C ~ 105°C (TA)
Supplier Device Package
56-QFN (8x8)
AttributeValue
GradeAutomotive
Series-
FunctionController - Commutation, Direction Management
InterfaceSPI
PackagingBulk
TechnologyPower MOSFET
ApplicationsGeneral Purpose
ManufacturerNXP Semiconductors
Mounting TypeSurface Mount
QualificationAEC-Q100
Package / Case56-VFQFN Exposed Pad
Voltage - Load6V ~ 58V
Step Resolution-
Current - Output-
Voltage - Supply6V ~ 58V
Motor Type - AC, DCBrushless DC (BLDC)
Motor Type - StepperMultiphase
Output ConfigurationHalf Bridge (3)
Operating Temperature-20°C ~ 105°C (TA)
Supplier Device Package56-QFN (8x8)

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Packaging Process