NXP Semiconductors MC33GD3100B3EK
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8542.39.00.90 |
| PPAP | Unknown |
| SVHC | Yes |
| Type | IGBT|MOSFET|SiCMOSFET |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Pin Count | 32 |
| Automotive | Yes |
| Bridge Type | Half Bridge |
| PCB changed | 32 |
| Availability | In Stock (cut strips) |
| Package Width | 7.6(Max) |
| Package Height | 2.36(Max) |
| Package Length | 11.1(Max) |
| Supplier Package | SOIC W |
| Number of Drivers | 1 |
| Number of Outputs | 1 |
| Standard Package Name | SO |
| Manufacturer Lead Time | 16 weeks |
| Peak Output Current (A) | 15 |
| Input Logic Compatibility | 3.3V|5V |
| Supplier Temperature Grade | Automotive |
| Maximum Operating Frequency (kHz) | 40 |
| Maximum Operating Temperature (°C) | 125 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 40 |
| Minimum Operating Supply Voltage (V) | 5 |
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Packaging Process
