10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors MC12311CHNR

NXP Semiconductors MC12311CHNR electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
MC12311CHNR
Package
MAP-LGA
Packaging
Tape and Reel
Description
SOC MC12311 HCS08 60-Pin MAP-LGA T/R
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
CAN
0
HTS
8542.31.00.70
I2C
0
I2S
0
PCI
0
PWM
1
SPI
1
USB
0
PPAP
No
SVHC
Yes
Type
Applications Processor
UART
1
USART
0
EU RoHS
Compliant
Ethernet
0
Mounting
Surface Mount
RAM Size
2KB
ECCN (US)
5A002a.
Packaging
Tape and Reel
Pin Count
60
Automotive
No
Device Core
HCS08
Family Name
MC12311
PCB changed
60
Availability
No Stock Available
Package Width
8 mm
Interface Type
SPI/UART
Package Height
0.94(Max) mm
Package Length
8 mm
Processing Unit
Microcontroller
Programmability
Yes
Supplier Package
MAP-LGA
Program Memory Size
32KB
Program Memory Type
Flash
Data Bus Width (bit)
8
Standard Package Name
LGA
Number of Watchdog Timers
1
Maximum Clock Frequency (MHz)
32
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
AttributeValue
CAN0
HTS8542.31.00.70
I2C0
I2S0
PCI0
PWM1
SPI1
USB0
PPAPNo
SVHCYes
TypeApplications Processor
UART1
USART0
EU RoHSCompliant
Ethernet0
MountingSurface Mount
RAM Size2KB
ECCN (US)5A002a.
PackagingTape and Reel
Pin Count60
AutomotiveNo
Device CoreHCS08
Family NameMC12311
PCB changed60
AvailabilityNo Stock Available
Package Width8 mm
Interface TypeSPI/UART
Package Height0.94(Max) mm
Package Length8 mm
Processing UnitMicrocontroller
ProgrammabilityYes
Supplier PackageMAP-LGA
Program Memory Size32KB
Program Memory TypeFlash
Data Bus Width (bit)8
Standard Package NameLGA
Number of Watchdog Timers1
Maximum Clock Frequency (MHz)32
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40

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Packaging Process