10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors M82172G23

NXP Semiconductors M82172G23 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
M82172G23
Package
TEBGA
Description
High Reliability Communication Device
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8542.39.00.90
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
5A002.a.1
Pin Count
672
Automotive
No
Lead Shape
Ball
PCB changed
672
Availability
No Stock Available
Supplier Package
TEBGA
Standard Package Name
BGA
AttributeValue
HTS8542.39.00.90
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)5A002.a.1
Pin Count672
AutomotiveNo
Lead ShapeBall
PCB changed672
AvailabilityNo Stock Available
Supplier PackageTEBGA
Standard Package NameBGA

Purchase & Inquiry

Placing an Order

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Payment Options

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RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process