10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors CLRC63201T/0FE,112

NXP Semiconductors CLRC63201T/0FE,112 electronic component product image

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Manufacturer
Manufacturer No
CLRC63201T/0FE,112
Date Code
18+
Quantity
60
Availability
In Stock
Package
SO
Packaging
Bulk
Description
NFC/RFID Read/Write 13.56MHz 32-Pin SO Bulk
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
COMPONENTS
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Operation
Read/Write
Packaging
Bulk
Pin Count
32
Automotive
No
Lead Shape
Gull-wing
PCB changed
32
Availability
No Stock Available
Package Width
7.6(Max)
Host Interface
SPI
Package Height
2.45(Max)
Package Length
20.7(Max)
Supplier Package
SO
Covered Range (mm)
100
Protocols Supported
MIFARE|ISO/IEC 14443-B|ISO/IEC 14443-A
Frequency Range (MHz)
13.56(Typ)
Standard Package Name
SO
Module/IC Classification
IC
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-25
Maximum Operating Supply Voltage (V)
3.6
AttributeValue
HTSCOMPONENTS
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
OperationRead/Write
PackagingBulk
Pin Count32
AutomotiveNo
Lead ShapeGull-wing
PCB changed32
AvailabilityNo Stock Available
Package Width7.6(Max)
Host InterfaceSPI
Package Height2.45(Max)
Package Length20.7(Max)
Supplier PackageSO
Covered Range (mm)100
Protocols SupportedMIFARE|ISO/IEC 14443-B|ISO/IEC 14443-A
Frequency Range (MHz)13.56(Typ)
Standard Package NameSO
Module/IC ClassificationIC
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-25
Maximum Operating Supply Voltage (V)3.6

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Packaging Process