NXP Semiconductors CLRC63201T/0FE,112

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| Attribute | Value |
|---|---|
| HTS | COMPONENTS |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Operation | Read/Write |
| Packaging | Bulk |
| Pin Count | 32 |
| Automotive | No |
| Lead Shape | Gull-wing |
| PCB changed | 32 |
| Availability | No Stock Available |
| Package Width | 7.6(Max) |
| Host Interface | SPI |
| Package Height | 2.45(Max) |
| Package Length | 20.7(Max) |
| Supplier Package | SO |
| Covered Range (mm) | 100 |
| Protocols Supported | MIFARE|ISO/IEC 14443-B|ISO/IEC 14443-A |
| Frequency Range (MHz) | 13.56(Typ) |
| Standard Package Name | SO |
| Module/IC Classification | IC |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -25 |
| Maximum Operating Supply Voltage (V) | 3.6 |
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Packaging Process











