10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors BLF6G27LS-75,112

NXP Semiconductors BLF6G27LS-75,112 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
BLF6G27LS-75,112
Date Code
1009
Quantity
580
Availability
In Stock
Package
SOT-502B
Packaging
Bulk
Description
Trans RF MOSFET N-CH 65V 18A 3-Pin SOT-502B Bulk
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Bulk
Pin Count
3
Automotive
No
Lead Shape
Flat
PCB changed
3
Availability
No Stock Available
Channel Mode
Enhancement
Channel Type
N
Maximum VSWR
10
Configuration
Single
Package Width
9.91(Max)
Package Height
4.72(Max)
Package Length
20.7(Max)
Supplier Package
SOT-502B
Mode of Operation
1-Carrier N-CDMA
Standard Package Name
SOT
Maximum Frequency (MHz)
2700
Minimum Frequency (MHz)
2500
Typical Power Gain (dB)
17
Maximum Output Power (W)
75(Typ)
Number of Elements per Chip
1
Typical Drain Efficiency (%)
23
Maximum Gate-Source Voltage (V)
13
Maximum Drain-Source Voltage (V)
65
Maximum Operating Temperature (°C)
200
Minimum Operating Temperature (°C)
-65
Maximum Continuous Drain Current (A)
18
Typical Forward Transconductance (S)
7
Maximum Drain-Source Resistance (mOhm)
Typical Reverse Transfer Capacitance @ Vds (pF)
1.6@28V
AttributeValue
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingBulk
Pin Count3
AutomotiveNo
Lead ShapeFlat
PCB changed3
AvailabilityNo Stock Available
Channel ModeEnhancement
Channel TypeN
Maximum VSWR10
ConfigurationSingle
Package Width9.91(Max)
Package Height4.72(Max)
Package Length20.7(Max)
Supplier PackageSOT-502B
Mode of Operation1-Carrier N-CDMA
Standard Package NameSOT
Maximum Frequency (MHz)2700
Minimum Frequency (MHz)2500
Typical Power Gain (dB)17
Maximum Output Power (W)75(Typ)
Number of Elements per Chip1
Typical Drain Efficiency (%)23
Maximum Gate-Source Voltage (V)13
Maximum Drain-Source Voltage (V)65
Maximum Operating Temperature (°C)200
Minimum Operating Temperature (°C)-65
Maximum Continuous Drain Current (A)18
Typical Forward Transconductance (S)7
Maximum Drain-Source Resistance (mOhm)[email protected]
Typical Reverse Transfer Capacitance @ Vds (pF)1.6@28V

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Packaging Process