NXP Semiconductors BFG10/X,215
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| Attribute | Value |
|---|---|
| Tab | Tab |
| PPAP | No |
| Type | NPN |
| EU RoHS | Compliant |
| Material | Si |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 4 |
| Automotive | No |
| Lead Shape | Gull-wing |
| PCB changed | 3 |
| Availability | No Stock Available |
| Configuration | Single Dual Emitter |
| Package Width | 1.4(Max) |
| Package Height | 1(Max) |
| Package Length | 3(Max) |
| Supplier Package | SOT-143B |
| Standard Package Name | SOT |
| Minimum DC Current Gain | 25@50mA@5V |
| Typical Power Gain (dB) | 7 |
| Maximum Output Power (W) | 0.2 |
| Number of Elements per Chip | 1 |
| Minimum DC Current Gain Range | 2 to 30 |
| Maximum Power Dissipation (mW) | 400 |
| Maximum Base-Emitter Voltage (V) | 2.5 |
| Maximum DC Collector Current (A) | 0.25 |
| Maximum Collector-Base Voltage (V) | 20 |
| Maximum Operating Temperature (°C) | 175 |
| Minimum Operating Temperature (°C) | -65 |
| Maximum Collector-Emitter Voltage (V) | 8 |
| Maximum DC Collector Current Range (A) | 0.12 to 0.5 |
| Maximum Collector-Emitter Voltage Range (V) | <20 |
| Maximum Junction Ambient Thermal Resistance | 290 |
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Packaging Process
