NXP Semiconductors BF1204,115
Image is only for reference
| Attribute | Value |
|---|---|
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 6 |
| Automotive | No |
| Lead Shape | Gull-wing |
| PCB changed | 6 |
| Availability | No Stock Available |
| Channel Mode | Enhancement |
| Channel Type | N |
| Configuration | Dual Dual Gate |
| Package Width | 1.35(Max) |
| Package Height | 1(Max) |
| Package Length | 2.2(Max) |
| Supplier Package | TSSOP |
| Standard Package Name | SO |
| Typical Power Gain (dB) | 34 |
| Number of Elements per Chip | 2 |
| Maximum Power Dissipation (mW) | 200 |
| Maximum Gate-Source Voltage (V) | 6 |
| Maximum Drain-Source Voltage (V) | 10 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -65 |
| Maximum Continuous Drain Current (A) | 0.03 |
| Typical Input Capacitance @ Vds (pF) | 1.7@5V@Gate 1|3.3@5V@Gate 2 |
| Typical Output Capacitance @ Vds (pF) | 0.85@5V |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 0.015@5V |
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Packaging Process
