10-13 NOV 2026 · Munich, Germany

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NXP Semiconductors BC817RA147

NXP Semiconductors BC817RA147 electronic component product image

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Manufacturer
Manufacturer No
BC817RA147
Availability
In Stock
Package
6-XFDFN Exposed Pad
Packaging
Bulk
Description
TRANS 2NPN 45V 500MA DFN1412-6
Detailed Description
Bipolar (BJT) Transistor Array 2 NPN 45V 500mA 100MHz 500mW Surface Mount DFN1412-6
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Grade
Automotive
Series
-
Packaging
Bulk
Power - Max
500mW
Manufacturer
NXP Semiconductors
Mounting Type
Surface Mount
Qualification
AEC-Q101
Package / Case
6-XFDFN Exposed Pad
Transistor Type
2 NPN
Base Product Number
BC817
Operating Temperature
150°C (TJ)
Frequency - Transition
100MHz
Supplier Device Package
DFN1412-6
Vce Saturation (Max) @ Ib, Ic
700mV @ 50mA, 500mA
Current - Collector (Ic) (Max)
500mA
Current - Collector Cutoff (Max)
100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce
160 @ 100mA, 1V
Voltage - Collector Emitter Breakdown (Max)
45V
AttributeValue
GradeAutomotive
Series-
PackagingBulk
Power - Max500mW
ManufacturerNXP Semiconductors
Mounting TypeSurface Mount
QualificationAEC-Q101
Package / Case6-XFDFN Exposed Pad
Transistor Type2 NPN
Base Product NumberBC817
Operating Temperature150°C (TJ)
Frequency - Transition100MHz
Supplier Device PackageDFN1412-6
Vce Saturation (Max) @ Ib, Ic700mV @ 50mA, 500mA
Current - Collector (Ic) (Max)500mA
Current - Collector Cutoff (Max)100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce160 @ 100mA, 1V
Voltage - Collector Emitter Breakdown (Max)45V

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Packaging Process