NXP Semiconductors BAP51-02,115
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8541.10.00.70 |
| PPAP | Yes |
| SVHC | Yes |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Pin Count | 2 |
| Automotive | Yes |
| Lead Shape | Flat |
| PCB changed | 2 |
| Availability | In Stock (cut strips) |
| Configuration | Single |
| Package Width | 0.85(Max) |
| Package Height | 0.65(Max) |
| Package Length | 1.25(Max) |
| Supplier Package | SOD-523 |
| Standard Package Name | SOD |
| Manufacturer Lead Time | 99 weeks |
| Supplier Temperature Grade | Automotive |
| Maximum Forward Voltage (V) | 1.1 |
| Maximum Reverse Voltage (V) | 60 |
| Maximum Diode Capacitance (pF) | 0.35@5V |
| Maximum Power Dissipation (mW) | 715 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -65 |
| Maximum Continuous Forward Current (mA) | 50 |
| Maximum Series Resistance @ Maximum IF (Ohm) | 2.5@10mA |
| Maximum Series Resistance @ Minimum IF (Ohm) | [email protected] |
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Packaging Process
