NXP Semiconductors A2T27S007NT1

NXP Semiconductors A2T27S007NT1 electronic component product image

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Manufacturer
Manufacturer No
A2T27S007NT1
Package
16-VDFN Exposed Pad
Packaging
Bulk
Description
RF MOSFET LDMOS 28V 16DFN
Detailed Description
RF Mosfet 28 V 60 mA 400MHz ~ 2.7GHz 18.9dB 28.8dBm 16-DFN (4x6)
Datasheet
Payment
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Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Gain
18.9dB
Series
-
Frequency
400MHz ~ 2.7GHz
Packaging
Bulk
Technology
LDMOS
Manufacturer
NXP Semiconductors
Noise Figure
-
Current - Test
60 mA
Package / Case
16-VDFN Exposed Pad
Power - Output
28.8dBm
Voltage - Test
28 V
Voltage - Rated
65 V
Current Rating (Amps)
10µA
Supplier Device Package
16-DFN (4x6)
AttributeValue
Gain18.9dB
Series-
Frequency400MHz ~ 2.7GHz
PackagingBulk
TechnologyLDMOS
ManufacturerNXP Semiconductors
Noise Figure-
Current - Test60 mA
Package / Case16-VDFN Exposed Pad
Power - Output28.8dBm
Voltage - Test28 V
Voltage - Rated65 V
Current Rating (Amps)10µA
Supplier Device Package16-DFN (4x6)

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping