10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors A2T27S007NT1

NXP Semiconductors A2T27S007NT1 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
A2T27S007NT1
Package
16-VDFN Exposed Pad
Packaging
Bulk
Description
RF MOSFET LDMOS 28V 16DFN
Detailed Description
RF Mosfet 28 V 60 mA 400MHz ~ 2.7GHz 18.9dB 28.8dBm 16-DFN (4x6)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Gain
18.9dB
Series
-
Frequency
400MHz ~ 2.7GHz
Packaging
Bulk
Technology
LDMOS
Manufacturer
NXP Semiconductors
Noise Figure
-
Current - Test
60 mA
Package / Case
16-VDFN Exposed Pad
Power - Output
28.8dBm
Voltage - Test
28 V
Voltage - Rated
65 V
Current Rating (Amps)
10µA
Supplier Device Package
16-DFN (4x6)
AttributeValue
Gain18.9dB
Series-
Frequency400MHz ~ 2.7GHz
PackagingBulk
TechnologyLDMOS
ManufacturerNXP Semiconductors
Noise Figure-
Current - Test60 mA
Package / Case16-VDFN Exposed Pad
Power - Output28.8dBm
Voltage - Test28 V
Voltage - Rated65 V
Current Rating (Amps)10µA
Supplier Device Package16-DFN (4x6)

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Packaging Process