Micron Technology Inc. TE28F160C3BD90A

Micron Technology Inc. TE28F160C3BD90A electronic component product image

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Manufacturer No
TE28F160C3BD90A
Quantity
74,309
Availability
In Stock
Package
48-TFSOP (0.724", 18.40mm Width)
Packaging
Tray
Description
IC FLASH 16MBIT PAR 48TSOP I
Detailed Description
FLASH - Boot Block Memory IC 16Mbit Parallel 90 ns 48-TSOP I
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Micron Technology Inc.
Series
-
Packaging
Tray
Technology
FLASH - Boot Block
Access Time
90 ns
Memory Size
16Mbit
Memory Type
Non-Volatile
Memory Format
FLASH
Mounting Type
Surface Mount
Package / Case
48-TFSOP (0.724", 18.40mm Width)
Memory Interface
Parallel
Voltage - Supply
2.7V ~ 3.6V
Base Product Number
28F160C3
Memory Organization
1M x 16
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
48-TSOP I
Write Cycle Time - Word, Page
90ns
AttributeValue
MfrMicron Technology Inc.
Series-
PackagingTray
TechnologyFLASH - Boot Block
Access Time90 ns
Memory Size16Mbit
Memory TypeNon-Volatile
Memory FormatFLASH
Mounting TypeSurface Mount
Package / Case48-TFSOP (0.724", 18.40mm Width)
Memory InterfaceParallel
Voltage - Supply2.7V ~ 3.6V
Base Product Number28F160C3
Memory Organization1M x 16
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package48-TSOP I
Write Cycle Time - Word, Page90ns

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping