Micron Technology Inc. MT62F2G32D4DS-023 AIT:C

Micron Technology Inc. MT62F2G32D4DS-023 AIT:C electronic component product image

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Manufacturer No
MT62F2G32D4DS-023 AIT:C
Quantity
79,877
Availability
In Stock
Package
200-WFBGA
Packaging
Box
Description
IC DRAM 64GBIT PAR 200WFBGA
Detailed Description
SDRAM - Mobile LPDDR5 Memory IC 64Gbit Parallel 2.133 GHz 200-WFBGA (10x14.5)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Micron Technology Inc.
Grade
Automotive
Series
-
Packaging
Box
Technology
SDRAM - Mobile LPDDR5
Memory Size
64Gbit
Memory Type
Volatile
Memory Format
DRAM
Mounting Type
Surface Mount
Qualification
AEC-Q100
Package / Case
200-WFBGA
Clock Frequency
2.133 GHz
Memory Interface
Parallel
Voltage - Supply
1.05V
Base Product Number
MT62F2G32
Memory Organization
2G x 32
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 95°C
Supplier Device Package
200-WFBGA (10x14.5)
Write Cycle Time - Word, Page
-
AttributeValue
MfrMicron Technology Inc.
GradeAutomotive
Series-
PackagingBox
TechnologySDRAM - Mobile LPDDR5
Memory Size64Gbit
Memory TypeVolatile
Memory FormatDRAM
Mounting TypeSurface Mount
QualificationAEC-Q100
Package / Case200-WFBGA
Clock Frequency2.133 GHz
Memory InterfaceParallel
Voltage - Supply1.05V
Base Product NumberMT62F2G32
Memory Organization2G x 32
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 95°C
Supplier Device Package200-WFBGA (10x14.5)
Write Cycle Time - Word, Page-

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping