10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Micron Technology Inc. JS28F512P30BFA

Micron Technology Inc. JS28F512P30BFA electronic component product image

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Manufacturer No
JS28F512P30BFA
Quantity
79,900
Availability
In Stock
Package
56-TFSOP (0.724", 18.40mm Width)
Packaging
Tray
Description
IC FLASH 512MBIT PAR 56TSOP
Detailed Description
FLASH - NOR Memory IC 512Mbit Parallel 40 MHz 110 ns 56-TSOP
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Micron Technology Inc.
Series
Axcell™
Packaging
Tray
Technology
FLASH - NOR
Access Time
110 ns
Memory Size
512Mbit
Memory Type
Non-Volatile
Memory Format
FLASH
Mounting Type
Surface Mount
Package / Case
56-TFSOP (0.724", 18.40mm Width)
Clock Frequency
40 MHz
Memory Interface
Parallel
Voltage - Supply
1.7V ~ 2V
Base Product Number
JS28F512P30
Memory Organization
32M x 16
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
56-TSOP
Write Cycle Time - Word, Page
110ns
AttributeValue
MfrMicron Technology Inc.
SeriesAxcell™
PackagingTray
TechnologyFLASH - NOR
Access Time110 ns
Memory Size512Mbit
Memory TypeNon-Volatile
Memory FormatFLASH
Mounting TypeSurface Mount
Package / Case56-TFSOP (0.724", 18.40mm Width)
Clock Frequency40 MHz
Memory InterfaceParallel
Voltage - Supply1.7V ~ 2V
Base Product NumberJS28F512P30
Memory Organization32M x 16
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package56-TSOP
Write Cycle Time - Word, Page110ns

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Packaging Process