Microchip Technology ZL30237GGG2
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8542.39.00.90 |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tray |
| Pin Count | 100 |
| Automotive | No |
| Lead Shape | Ball |
| PCB changed | 100 |
| Availability | No Stock Available |
| Package Width | 11 |
| Package Height | 1.06 |
| Package Length | 11 |
| Supplier Package | CABGA |
| Input Logic Level | Crystal |
| Output Logic Level | LVCMOS|LVPECL |
| Standard Package Name | BGA |
| Manufacturer Lead Time | 8 weeks |
| Typical Duty Cycle (%) | 50 |
| Number of Outputs per Chip | 12 |
| Maximum Supply Current (mA) | 109 |
| Maximum Output Frequency (MHz) | 750 |
| Maximum Power Dissipation (mW) | 91 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 1.89/3.465 |
| Minimum Operating Supply Voltage (V) | 1.71/3.135 |
Purchase & Inquiry
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Packaging Process
