10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Microchip Technology VSC7423XJG-02

Microchip Technology VSC7423XJG-02 electronic component product image

Image is only for reference

Manufacturer No
VSC7423XJG-02
Date Code
14+
Quantity
29
Availability
In Stock
Package
HSBGA
Packaging
Tray
Description
Ethernet Switch 7-Port 2500Mbps 672-Pin HSBGA Tray
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8542.39.00.90
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
5A991.b
Packaging
Tray
Pin Count
672
Automotive
No
Lead Shape
Ball
PCB changed
672
Availability
In Stock
JTAG Support
Yes
VLAN Support
Yes
Fiber Support
No
Package Width
27
Package Length
27
Supplier Package
HSBGA
Standard Package Name
BGA
Integrated LED Drivers
Yes
Manufacturer Lead Time
7 weeks
Maximum Data Rate (Mbps)
2500
Typical Data Rate (Mbps)
10/100/1000/2500
PHY/Transceiver Interface
SGMII
Internal Memory Buffer Size
4MB
Number of Primary Switch Ports
7
Maximum Operating Temperature (°C)
125
Minimum Operating Temperature (°C)
-40
AttributeValue
HTS8542.39.00.90
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)5A991.b
PackagingTray
Pin Count672
AutomotiveNo
Lead ShapeBall
PCB changed672
AvailabilityIn Stock
JTAG SupportYes
VLAN SupportYes
Fiber SupportNo
Package Width27
Package Length27
Supplier PackageHSBGA
Standard Package NameBGA
Integrated LED DriversYes
Manufacturer Lead Time7 weeks
Maximum Data Rate (Mbps)2500
Typical Data Rate (Mbps)10/100/1000/2500
PHY/Transceiver InterfaceSGMII
Internal Memory Buffer Size4MB
Number of Primary Switch Ports7
Maximum Operating Temperature (°C)125
Minimum Operating Temperature (°C)-40

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process