Microchip Technology SY89876LMG-TR

Microchip Technology SY89876LMG-TR electronic component product image

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Manufacturer No
SY89876LMG-TR
Quantity
2
Availability
In Stock
Package
16-VFQFN Exposed Pad, 16-MLF®
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
IC CLK BUFFER 1:2 2GHZ 16MLF
Detailed Description
Clock Fanout Buffer (Distribution), Divider IC 1:2 2 GHz 16-VFQFN Exposed Pad, 16-MLF®
Datasheet
Payment
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Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Type
Fanout Buffer (Distribution), Divider
Input
CML, HSTL, LVDS, LVPECL
Output
LVDS
Series
Precision Edge®
Packaging
Tape & Reel (TR); Cut Tape (CT)
Manufacturer
Microchip Technology
Mounting Type
Surface Mount
Package / Case
16-VFQFN Exposed Pad, 16-MLF®
Frequency - Max
2 GHz
Voltage - Supply
2.97V ~ 3.63V
Number of Circuits
1
Base Product Number
SY89876
Ratio - Input:Output
1:2
Operating Temperature
-40°C ~ 85°C
Supplier Device Package
16-MLF® (3x3)
Differential - Input:Output
Yes/Yes
AttributeValue
TypeFanout Buffer (Distribution), Divider
InputCML, HSTL, LVDS, LVPECL
OutputLVDS
SeriesPrecision Edge®
PackagingTape & Reel (TR); Cut Tape (CT)
ManufacturerMicrochip Technology
Mounting TypeSurface Mount
Package / Case16-VFQFN Exposed Pad, 16-MLF®
Frequency - Max2 GHz
Voltage - Supply2.97V ~ 3.63V
Number of Circuits1
Base Product NumberSY89876
Ratio - Input:Output1:2
Operating Temperature-40°C ~ 85°C
Supplier Device Package16-MLF® (3x3)
Differential - Input:OutputYes/Yes

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