Microchip Technology PLA133-97QA-RVAO

Microchip Technology PLA133-97QA-RVAO electronic component product image

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Manufacturer No
PLA133-97QA-RVAO
Package
16-VFQFN Exposed Pad
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
IC FANOUT BUFFER 16VQFN
Detailed Description
Fanout Buffer (Distribution) IC 160MHz 1 16-VFQFN Exposed Pad
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
PLL
No
Type
Fanout Buffer (Distribution)
Grade
Automotive
Input
LVCMOS
Output
LVCMOS
Series
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Manufacturer
Microchip Technology
Mounting Type
Surface Mount
Qualification
AEC-Q100
Package / Case
16-VFQFN Exposed Pad
Frequency - Max
160MHz
Voltage - Supply
1.71V ~ 3.63V
Divider/Multiplier
No/No
Number of Circuits
1
DigiKey Programmable
Not Verified
Ratio - Input:Output
1:9
Operating Temperature
-40°C ~ 125°C (TA)
Supplier Device Package
16-VQFN (3x3)
Differential - Input:Output
No/No
AttributeValue
PLLNo
TypeFanout Buffer (Distribution)
GradeAutomotive
InputLVCMOS
OutputLVCMOS
Series-
PackagingTape & Reel (TR); Cut Tape (CT)
ManufacturerMicrochip Technology
Mounting TypeSurface Mount
QualificationAEC-Q100
Package / Case16-VFQFN Exposed Pad
Frequency - Max160MHz
Voltage - Supply1.71V ~ 3.63V
Divider/MultiplierNo/No
Number of Circuits1
DigiKey ProgrammableNot Verified
Ratio - Input:Output1:9
Operating Temperature-40°C ~ 125°C (TA)
Supplier Device Package16-VQFN (3x3)
Differential - Input:OutputNo/No

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
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Step6: Shipping