Microchip Technology MSCDC200A170D1PAG

Microchip Technology MSCDC200A170D1PAG electronic component product image

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Manufacturer No
MSCDC200A170D1PAG
Availability
In Stock
Package
Module
Packaging
Box
Description
DIODE MODULE SIC 1700V 200A D1P
Detailed Description
Diode Array 1 Pair Series Connection 1700 V 200A Chassis Mount Module
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
No Recovery Time > 500mA (Io)
Series
-
Packaging
Box
Technology
SiC (Silicon Carbide) Schottky
Manufacturer
Microchip Technology
Mounting Type
Chassis Mount
Package / Case
Module
Base Product Number
MSCDC200
Diode Configuration
1 Pair Series Connection
Supplier Device Package
D1P
Reverse Recovery Time (trr)
0 ns
Current - Reverse Leakage @ Vr
800 µA @ 1700 V
Voltage - DC Reverse (Vr) (Max)
1700 V
Operating Temperature - Junction
-40°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If
1.8 V @ 200 A
Current - Average Rectified (Io) (per Diode)
200A
AttributeValue
SpeedNo Recovery Time > 500mA (Io)
Series-
PackagingBox
TechnologySiC (Silicon Carbide) Schottky
ManufacturerMicrochip Technology
Mounting TypeChassis Mount
Package / CaseModule
Base Product NumberMSCDC200
Diode Configuration1 Pair Series Connection
Supplier Device PackageD1P
Reverse Recovery Time (trr)0 ns
Current - Reverse Leakage @ Vr800 µA @ 1700 V
Voltage - DC Reverse (Vr) (Max)1700 V
Operating Temperature - Junction-40°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If1.8 V @ 200 A
Current - Average Rectified (Io) (per Diode)200A

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping