Microchip Technology MIC864YMX-T5

Microchip Technology MIC864YMX-T5 electronic component product image

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Manufacturer No
MIC864YMX-T5
Package
10-XFDFN Exposed Pad
Packaging
Tape & Reel (TR)
Description
IC OPAMP GP 2 CIRCUIT 10TDFN
Detailed Description
Standard (General Purpose) Amplifier 2 Circuit Rail-to-Rail 10-TDFN (2.5x2.5)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Microchip Technology
Series
-
Packaging
Tape & Reel (TR)
Slew Rate
0.2V/µs
Output Type
Rail-to-Rail
Mounting Type
Surface Mount
Amplifier Type
Standard (General Purpose)
Package / Case
10-XFDFN Exposed Pad
Current - Supply
33µA (x2 Channels)
Number of Circuits
2
Base Product Number
MIC864
Current - Input Bias
2.5 pA
Operating Temperature
-40°C ~ 125°C
Gain Bandwidth Product
350 kHz
Voltage - Input Offset
2 mV
Supplier Device Package
10-TDFN (2.5x2.5)
Current - Output / Channel
23 mA
Voltage - Supply Span (Max)
5.5 V
Voltage - Supply Span (Min)
2.5 V
AttributeValue
MfrMicrochip Technology
Series-
PackagingTape & Reel (TR)
Slew Rate0.2V/µs
Output TypeRail-to-Rail
Mounting TypeSurface Mount
Amplifier TypeStandard (General Purpose)
Package / Case10-XFDFN Exposed Pad
Current - Supply33µA (x2 Channels)
Number of Circuits2
Base Product NumberMIC864
Current - Input Bias2.5 pA
Operating Temperature-40°C ~ 125°C
Gain Bandwidth Product350 kHz
Voltage - Input Offset2 mV
Supplier Device Package10-TDFN (2.5x2.5)
Current - Output / Channel23 mA
Voltage - Supply Span (Max)5.5 V
Voltage - Supply Span (Min)2.5 V

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping