10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Microchip Technology M38510/14103BEA

Microchip Technology M38510/14103BEA electronic component product image

Image is only for reference

Manufacturer No
M38510/14103BEA
Package
CDIP
Description
Trans Darlington NPN 50V 0.5A 16-Pin CDIP
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8541.21.00.75
PPAP
No
SVHC
Yes
Type
NPN
EU RoHS
Not Compliant
Mounting
Through Hole
ECCN (US)
EAR99
Pin Count
16
Automotive
No
Lead Shape
Through Hole
PCB changed
16
Availability
No Stock Available
Configuration
Array 7
Supplier Package
CDIP
Standard Package Name
DIP
SVHC Exceeds Threshold
Yes
Minimum DC Current Gain
1000@350mA@2V
Supplier Temperature Grade
Military
Number of Elements per Chip
7
Maximum Operating Temperature (°C)
125
Minimum Operating Temperature (°C)
-55
Maximum Collector-Emitter Voltage (V)
50
Maximum Continuous DC Collector Current (A)
0.5
Maximum Collector-Emitter Saturation Voltage (V)
1.1@250uA@100mA|1.3@350uA@200mA|1.6@500uA@350mA
AttributeValue
HTS8541.21.00.75
PPAPNo
SVHCYes
TypeNPN
EU RoHSNot Compliant
MountingThrough Hole
ECCN (US)EAR99
Pin Count16
AutomotiveNo
Lead ShapeThrough Hole
PCB changed16
AvailabilityNo Stock Available
ConfigurationArray 7
Supplier PackageCDIP
Standard Package NameDIP
SVHC Exceeds ThresholdYes
Minimum DC Current Gain1000@350mA@2V
Supplier Temperature GradeMilitary
Number of Elements per Chip7
Maximum Operating Temperature (°C)125
Minimum Operating Temperature (°C)-55
Maximum Collector-Emitter Voltage (V)50
Maximum Continuous DC Collector Current (A)0.5
Maximum Collector-Emitter Saturation Voltage (V)1.1@250uA@100mA|1.3@350uA@200mA|1.6@500uA@350mA

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process