Step1: Product
Microchip Technology M2S010TS-1FGG484
Images are for reference only
Manufacturer
Manufacturer No
M2S010TS-1FGG484
Availability
In Stock
Package
484-BGA
Packaging
Tray
Description
IC SOC CORTEX-M3 166MHZ 484FBGA
Detailed Description
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 10K Logic Modules 166MHz 484-FPBGA (23x23)
Datasheet
Payment
Delivery
Speed
166MHz
Series
SmartFusion®2
RAM Size
64KB
Packaging
Tray
Flash Size
256KB
Peripherals
DDR, PCIe, SERDES
Architecture
MCU, FPGA
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Manufacturer
Microchip Technology
Number of I/O
233
Core Processor
ARM® Cortex®-M3
Package / Case
484-BGA
Primary Attributes
FPGA - 10K Logic Modules
Base Product Number
M2S010
Operating Temperature
0°C ~ 85°C (TJ)
Supplier Device Package
484-FPBGA (23x23)
| Attribute | Value |
|---|---|
| Speed | 166MHz |
| Series | SmartFusion®2 |
| RAM Size | 64KB |
| Packaging | Tray |
| Flash Size | 256KB |
| Peripherals | DDR, PCIe, SERDES |
| Architecture | MCU, FPGA |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Manufacturer | Microchip Technology |
| Number of I/O | 233 |
| Core Processor | ARM® Cortex®-M3 |
| Package / Case | 484-BGA |
| Primary Attributes | FPGA - 10K Logic Modules |
| Base Product Number | M2S010 |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 484-FPBGA (23x23) |
Purchase & Inquiry
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Important Notes
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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.
Packaging Process
Step2: Vacuum Packaging
Step3: Anti-Static Bag
Step4: Package Boxes
Step5: Bar-Code Shipping Tags
Step6: Shipping
