Microchip Technology M2S005-TQ144I

Microchip Technology M2S005-TQ144I electronic component product image

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Manufacturer No
M2S005-TQ144I
Package
144-LQFP
Packaging
Tray
Description
IC SOC CORTEX-M3 166MHZ 144TQFP
Detailed Description
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 5K Logic Modules 166MHz 144-TQFP (20x20)
Datasheet
Payment
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Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
166MHz
Series
SmartFusion®2
RAM Size
64KB
Packaging
Tray
Flash Size
128KB
Peripherals
-
Architecture
MCU, FPGA
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Manufacturer
Microchip Technology
Number of I/O
84
Core Processor
ARM® Cortex®-M3
Package / Case
144-LQFP
Primary Attributes
FPGA - 5K Logic Modules
Operating Temperature
-40°C ~ 100°C (TJ)
Supplier Device Package
144-TQFP (20x20)
AttributeValue
Speed166MHz
SeriesSmartFusion®2
RAM Size64KB
PackagingTray
Flash Size128KB
Peripherals-
ArchitectureMCU, FPGA
ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
ManufacturerMicrochip Technology
Number of I/O84
Core ProcessorARM® Cortex®-M3
Package / Case144-LQFP
Primary AttributesFPGA - 5K Logic Modules
Operating Temperature-40°C ~ 100°C (TJ)
Supplier Device Package144-TQFP (20x20)

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping