Microchip Technology LE87271EQCT

Microchip Technology LE87271EQCT electronic component product image

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Manufacturer No
LE87271EQCT
Quantity
25
Availability
In Stock
Package
20-VFQFN Exposed Pad
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
XDSL CPE LINE DRIVER
Detailed Description
Telecom IC Line Driver 20-QFN (4x4)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Function
Line Driver
Interface
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Manufacturer
Microchip Technology
Mounting Type
Surface Mount
Power (Watts)
1.37 W
Package / Case
20-VFQFN Exposed Pad
Current - Supply
26.1mA
Voltage - Supply
12.6V ~ 15.4V
Number of Circuits
1
Base Product Number
LE87271
Operating Temperature
-40°C ~ 125°C
Supplier Device Package
20-QFN (4x4)
AttributeValue
Series-
FunctionLine Driver
Interface-
PackagingTape & Reel (TR); Cut Tape (CT)
ManufacturerMicrochip Technology
Mounting TypeSurface Mount
Power (Watts)1.37 W
Package / Case20-VFQFN Exposed Pad
Current - Supply26.1mA
Voltage - Supply12.6V ~ 15.4V
Number of Circuits1
Base Product NumberLE87271
Operating Temperature-40°C ~ 125°C
Supplier Device Package20-QFN (4x4)

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping