10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Microchip Technology ECE1088-DZK

Microchip Technology ECE1088-DZK electronic component product image

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Manufacturer No
ECE1088-DZK
Availability
In Stock
Package
QFN
Packaging
Tray
Description
SMBus Interface 400kHz 28-Pin QFN Tray
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8542.39.00.90
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
3A991.a.2
Packaging
Tray
Pin Count
28
Automotive
No
Lead Shape
No Lead
Output Type
Open Drain|Push Pull
PCB changed
28
Availability
No Stock Available
Manual Reset
No
Package Width
5
Interface Type
SMBus
Number of I/Os
20
Package Height
0.83
Package Length
5
Supplier Package
QFN
Number of Addresses
1
Interface Speed (kHz)
400
Standard Package Name
QFN
I2C Bus Interface Mode
Fast
Interrupt Output Option
Yes
Maximum Sink Current per Bit (mA)
8
Maximum Operating Temperature (°C)
70
Maximum Source Current per Bit (mA)
-4
Minimum Operating Temperature (°C)
0
AttributeValue
HTS8542.39.00.90
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A991.a.2
PackagingTray
Pin Count28
AutomotiveNo
Lead ShapeNo Lead
Output TypeOpen Drain|Push Pull
PCB changed28
AvailabilityNo Stock Available
Manual ResetNo
Package Width5
Interface TypeSMBus
Number of I/Os20
Package Height0.83
Package Length5
Supplier PackageQFN
Number of Addresses1
Interface Speed (kHz)400
Standard Package NameQFN
I2C Bus Interface ModeFast
Interrupt Output OptionYes
Maximum Sink Current per Bit (mA)8
Maximum Operating Temperature (°C)70
Maximum Source Current per Bit (mA)-4
Minimum Operating Temperature (°C)0

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Packaging Process