Microchip Technology ATA5575M2330-DBN

Microchip Technology ATA5575M2330-DBN electronic component product image

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Manufacturer No
ATA5575M2330-DBN
Package
Die
Packaging
Tray
Description
IC RFID TRANSP 100-150KHZ DIE
Detailed Description
RFID Transponder IC 100kHz ~ 150kHz ISO 11784, ISO 11785 Die
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Type
RFID Transponder
Series
-
Frequency
100kHz ~ 150kHz
Interface
-
Packaging
Tray
Standards
ISO 11784, ISO 11785
Manufacturer
Microchip Technology
Mounting Type
Surface Mount
Package / Case
Die
Voltage - Supply
-
Base Product Number
ATA5575M2
Operating Temperature
-40°C ~ 85°C
Supplier Device Package
Die
AttributeValue
TypeRFID Transponder
Series-
Frequency100kHz ~ 150kHz
Interface-
PackagingTray
StandardsISO 11784, ISO 11785
ManufacturerMicrochip Technology
Mounting TypeSurface Mount
Package / CaseDie
Voltage - Supply-
Base Product NumberATA5575M2
Operating Temperature-40°C ~ 85°C
Supplier Device PackageDie

Purchase & Inquiry

Placing an Order

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Payment Options

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RFQ (Request for Quote)

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping