Microchip Technology APTDF300A120D16AG

Microchip Technology APTDF300A120D16AG electronic component product image

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Manufacturer No
APTDF300A120D16AG
Package
Module
Packaging
Bulk
Description
DIODE MODULE GEN PURP 1200V 600A
Detailed Description
Diode Array 1 Pair Series Connection 1200 V 600A Chassis Mount Module
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Grade
-
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
-
Packaging
Bulk
Technology
Standard
Manufacturer
Microchip Technology
Mounting Type
Chassis Mount
Qualification
-
Package / Case
Module
Diode Configuration
1 Pair Series Connection
Supplier Device Package
-
Reverse Recovery Time (trr)
385 ns
Current - Reverse Leakage @ Vr
300 µA @ 1200 V
Voltage - DC Reverse (Vr) (Max)
1200 V
Operating Temperature - Junction
-40°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If
3.5 V @ 300 A
Current - Average Rectified (Io) (per Diode)
600A
AttributeValue
Grade-
SpeedFast Recovery =< 500ns, > 200mA (Io)
Series-
PackagingBulk
TechnologyStandard
ManufacturerMicrochip Technology
Mounting TypeChassis Mount
Qualification-
Package / CaseModule
Diode Configuration1 Pair Series Connection
Supplier Device Package-
Reverse Recovery Time (trr)385 ns
Current - Reverse Leakage @ Vr300 µA @ 1200 V
Voltage - DC Reverse (Vr) (Max)1200 V
Operating Temperature - Junction-40°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If3.5 V @ 300 A
Current - Average Rectified (Io) (per Diode)600A

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping