Microchip Technology APT60S20B2CTG

Microchip Technology APT60S20B2CTG electronic component product image

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Manufacturer No
APT60S20B2CTG
Quantity
3
Availability
In Stock
Package
TO-247-3 Variant
Packaging
Tube
Description
DIODE ARRAY SCHOTT 200V 75A TMAX
Detailed Description
Diode Array 1 Pair Common Cathode 200 V 75A Through Hole TO-247-3 Variant
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
-
Packaging
Tube
Technology
Schottky
Manufacturer
Microchip Technology
Mounting Type
Through Hole
Package / Case
TO-247-3 Variant
Base Product Number
APT60
Diode Configuration
1 Pair Common Cathode
Supplier Device Package
T-MAX™ [B2]
Reverse Recovery Time (trr)
55 ns
Current - Reverse Leakage @ Vr
1 mA @ 200 V
Voltage - DC Reverse (Vr) (Max)
200 V
Operating Temperature - Junction
-55°C ~ 150°C
Voltage - Forward (Vf) (Max) @ If
900 mV @ 60 A
Current - Average Rectified (Io) (per Diode)
75A
AttributeValue
SpeedFast Recovery =< 500ns, > 200mA (Io)
Series-
PackagingTube
TechnologySchottky
ManufacturerMicrochip Technology
Mounting TypeThrough Hole
Package / CaseTO-247-3 Variant
Base Product NumberAPT60
Diode Configuration1 Pair Common Cathode
Supplier Device PackageT-MAX™ [B2]
Reverse Recovery Time (trr)55 ns
Current - Reverse Leakage @ Vr1 mA @ 200 V
Voltage - DC Reverse (Vr) (Max)200 V
Operating Temperature - Junction-55°C ~ 150°C
Voltage - Forward (Vf) (Max) @ If900 mV @ 60 A
Current - Average Rectified (Io) (per Diode)75A

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping