Microchip Technology A54SX16P-1PQG208I

Microchip Technology A54SX16P-1PQG208I electronic component product image

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Manufacturer No
A54SX16P-1PQG208I
Package
208-BFQFP
Packaging
Tray
Description
IC FPGA 175 I/O 208QFP
Detailed Description
SX Field Programmable Gate Array (FPGA) IC 175 208-BFQFP
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Microchip Technology
Series
SX
Packaging
Tray
Mounting Type
Surface Mount
Number of I/O
175
Package / Case
208-BFQFP
Number of Gates
24000
Voltage - Supply
3V ~ 3.6V, 4.75V ~ 5.25V
Base Product Number
A54SX16
Number of LABs/CLBs
1452
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
208-PQFP (28x28)
AttributeValue
MfrMicrochip Technology
SeriesSX
PackagingTray
Mounting TypeSurface Mount
Number of I/O175
Package / Case208-BFQFP
Number of Gates24000
Voltage - Supply3V ~ 3.6V, 4.75V ~ 5.25V
Base Product NumberA54SX16
Number of LABs/CLBs1452
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package208-PQFP (28x28)

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping