10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Microchip Technology 2N4957UB

Microchip Technology 2N4957UB electronic component product image

Image is only for reference

Manufacturer No
2N4957UB
Package
Case UB
Packaging
Waffle
Description
Trans RF BJT PNP 30V 0.03A 200mW 4-Pin Case UB Waffle
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8541.21.00.75
PPAP
No
Type
PNP
EU RoHS
Not Compliant
Material
Si
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Waffle
Pin Count
4
Automotive
No
PCB changed
4
Availability
No Stock Available
Configuration
Single
Package Width
2.74(Max)
Package Height
1.42(Max)
Package Length
3.25(Max)
Supplier Package
Case UB
Minimum DC Current Gain
[email protected]@10V|20@2mA@10V|30@5mA@10V
Typical Power Gain (dB)
25(Max)
Maximum Noise Figure (dB)
3.5
Number of Elements per Chip
1
Operational Bias Conditions
10V/2mA
Minimum DC Current Gain Range
2 to 30|30 to 50
Maximum Power Dissipation (mW)
200
Maximum Base-Emitter Voltage (V)
3
Maximum DC Collector Current (A)
0.03
Maximum Collector-Base Voltage (V)
30
Maximum Operating Temperature (°C)
200
Minimum Operating Temperature (°C)
-65
Maximum Emitter Cut-Off Current (nA)
100000
Maximum Collector-Emitter Voltage (V)
30
Maximum Collector Cut-Off Current (nA)
100000
Maximum DC Collector Current Range (A)
0.001 to 0.06
Maximum Collector-Emitter Voltage Range (V)
30 to 40
AttributeValue
HTS8541.21.00.75
PPAPNo
TypePNP
EU RoHSNot Compliant
MaterialSi
MountingSurface Mount
ECCN (US)EAR99
PackagingWaffle
Pin Count4
AutomotiveNo
PCB changed4
AvailabilityNo Stock Available
ConfigurationSingle
Package Width2.74(Max)
Package Height1.42(Max)
Package Length3.25(Max)
Supplier PackageCase UB
Minimum DC Current Gain[email protected]@10V|20@2mA@10V|30@5mA@10V
Typical Power Gain (dB)25(Max)
Maximum Noise Figure (dB)3.5
Number of Elements per Chip1
Operational Bias Conditions10V/2mA
Minimum DC Current Gain Range2 to 30|30 to 50
Maximum Power Dissipation (mW)200
Maximum Base-Emitter Voltage (V)3
Maximum DC Collector Current (A)0.03
Maximum Collector-Base Voltage (V)30
Maximum Operating Temperature (°C)200
Minimum Operating Temperature (°C)-65
Maximum Emitter Cut-Off Current (nA)100000
Maximum Collector-Emitter Voltage (V)30
Maximum Collector Cut-Off Current (nA)100000
Maximum DC Collector Current Range (A)0.001 to 0.06
Maximum Collector-Emitter Voltage Range (V)30 to 40

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Packaging Process