Mercury Systems, Inc. WEDPN16M72V-100B2M
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| Attribute | Value |
|---|---|
| HTS | COMPONENTS |
| PLL | No |
| PPAP | No |
| Module | DRAM |
| EU RoHS | Supplier Unconfirmed |
| Mounting | Surface Mount |
| ECCN (US) | 4A994.a |
| Pin Count | 219 |
| Automotive | No |
| CAS Latency | 2|3 |
| ECC Support | Yes |
| PCB changed | 219 |
| Subcategory | SDRAM |
| Availability | In Stock |
| Organization | 16Mx72 |
| Self Refresh | No |
| Package Width | 21.1(Max) |
| Module Density | 1Gbit |
| Package Height | 2.03(Max) |
| Package Length | 25.1(Max) |
| Refresh Cycles | 8K |
| Supplier Package | BGA |
| Chip Package Type | PBGA |
| Chip Density (bit) | 230M |
| SPD EEPROM Support | No |
| Data Bus Width (bit) | 72 |
| Number of Chip Banks | 4 |
| Max. Access Time (ns) | 7 |
| Standard Package Name | BGA |
| Manufacturer Lead Time | 110 weeks |
| Operating Current (mA) | 625 |
| Maximum Clock Rate (MHz) | 100 |
| Supplier Temperature Grade | Military |
| Number of Memory Chips per Module | 5 |
| Maximum Operating Temperature (°C) | 125 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Supply Voltage (V) | 3 |
| Typical Operating Supply Voltage (V) | 3.3 |
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Packaging Process
