10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

MCC (Micro Commercial Components) DAN217-TP

MCC (Micro Commercial Components) DAN217-TP electronic component product image

Image is only for reference

Manufacturer No
DAN217-TP
Package
TO-236-3, SC-59, SOT-23-3
Packaging
Bulk
Description
DIODE ARRAY GP 80V 100MA SOT23
Detailed Description
Diode Array 1 Pair Series Connection 80 V 100mA Surface Mount TO-236-3, SC-59, SOT-23-3
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
-
Packaging
Bulk
Technology
Standard
Manufacturer
MCC (Micro Commercial Components)
Mounting Type
Surface Mount
Package / Case
TO-236-3, SC-59, SOT-23-3
Base Product Number
DAN217
Diode Configuration
1 Pair Series Connection
Supplier Device Package
SOT-23
Reverse Recovery Time (trr)
4 ns
Current - Reverse Leakage @ Vr
100 nA @ 70 V
Voltage - DC Reverse (Vr) (Max)
80 V
Operating Temperature - Junction
-40°C ~ 150°C
Voltage - Forward (Vf) (Max) @ If
1.2 V @ 100 mA
Current - Average Rectified (Io) (per Diode)
100mA
AttributeValue
SpeedFast Recovery =< 500ns, > 200mA (Io)
Series-
PackagingBulk
TechnologyStandard
ManufacturerMCC (Micro Commercial Components)
Mounting TypeSurface Mount
Package / CaseTO-236-3, SC-59, SOT-23-3
Base Product NumberDAN217
Diode Configuration1 Pair Series Connection
Supplier Device PackageSOT-23
Reverse Recovery Time (trr)4 ns
Current - Reverse Leakage @ Vr100 nA @ 70 V
Voltage - DC Reverse (Vr) (Max)80 V
Operating Temperature - Junction-40°C ~ 150°C
Voltage - Forward (Vf) (Max) @ If1.2 V @ 100 mA
Current - Average Rectified (Io) (per Diode)100mA

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Packaging Process