MaxLinear, Inc. PEF32002VTV12

MaxLinear, Inc. PEF32002VTV12 electronic component product image

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Manufacturer
Manufacturer No
PEF32002VTV12
Package
68-QFN
Packaging
Tray
Description
DATA COMM PEF32002VTV12 VQFN68 S
Detailed Description
Telecom IC Dual Channel Subscriber Line Interface Circuit (DuSLIC) 68-VQFN
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Grade
-
Series
DUSLIC™ XS
Function
Dual Channel Subscriber Line Interface Circuit (DuSLIC)
Interface
PCM, SPI
Packaging
Tray
Manufacturer
MaxLinear, Inc.
Mounting Type
Surface Mount
Qualification
-
Package / Case
68-QFN
Current - Supply
-
Voltage - Supply
-
Number of Circuits
2
Operating Temperature
-40°C ~ 85°C
Supplier Device Package
68-VQFN
AttributeValue
Grade-
SeriesDUSLIC™ XS
FunctionDual Channel Subscriber Line Interface Circuit (DuSLIC)
InterfacePCM, SPI
PackagingTray
ManufacturerMaxLinear, Inc.
Mounting TypeSurface Mount
Qualification-
Package / Case68-QFN
Current - Supply-
Voltage - Supply-
Number of Circuits2
Operating Temperature-40°C ~ 85°C
Supplier Device Package68-VQFN

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
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Step6: Shipping