10-13 NOV 2026 · Munich, Germany

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MagnaChip Semiconductor MDD1503RH

MagnaChip Semiconductor MDD1503RH electronic component product image

Image is only for reference

Manufacturer No
MDD1503RH
Package
DPAK
Packaging
Tape and Reel
Description
Trans MOSFET N-CH 30V 28.2A 3-Pin(2+Tab) DPAK T/R
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8541.29.00.55
Tab
Tab
PPAP
Unknown
EU RoHS
Compliant
Category
Power MOSFET
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Pin Count
3
Automotive
Unknown
Lead Shape
Gull-wing
PCB changed
2
Availability
No Stock Available
Channel Mode
Enhancement
Channel Type
N
Configuration
Single
Package Width
6.1
Package Height
2.39(Max)
Package Length
6.73(Max)
Supplier Package
DPAK
Maximum IDSS (uA)
1
Standard Package Name
TO
Manufacturer Lead Time
8 weeks
Typical Fall Time (ns)
9.2
Typical Rise Time (ns)
12.7
Number of Elements per Chip
1
Maximum Power Dissipation (mW)
6200
Typical Gate Charge @ 10V (nC)
28
Typical Gate Charge @ Vgs (nC)
Maximum Gate-Source Voltage (V)
±20
Typical Turn-On Delay Time (ns)
12
Maximum Drain-Source Voltage (V)
30
Typical Turn-Off Delay Time (ns)
30.6
Maximum Gate Threshold Voltage (V)
2.7
Maximum Operating Temperature (°C)
150
Minimum Operating Temperature (°C)
-55
Maximum Continuous Drain Current (A)
28.2
Typical Input Capacitance @ Vds (pF)
1799@15V
Maximum Drain-Source Resistance (mOhm)
4.7@10V
Maximum Gate-Source Leakage Current (nA)
100
AttributeValue
HTS8541.29.00.55
TabTab
PPAPUnknown
EU RoHSCompliant
CategoryPower MOSFET
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count3
AutomotiveUnknown
Lead ShapeGull-wing
PCB changed2
AvailabilityNo Stock Available
Channel ModeEnhancement
Channel TypeN
ConfigurationSingle
Package Width6.1
Package Height2.39(Max)
Package Length6.73(Max)
Supplier PackageDPAK
Maximum IDSS (uA)1
Standard Package NameTO
Manufacturer Lead Time8 weeks
Typical Fall Time (ns)9.2
Typical Rise Time (ns)12.7
Number of Elements per Chip1
Maximum Power Dissipation (mW)6200
Typical Gate Charge @ 10V (nC)28
Typical Gate Charge @ Vgs (nC)[email protected]|28@10V
Maximum Gate-Source Voltage (V)±20
Typical Turn-On Delay Time (ns)12
Maximum Drain-Source Voltage (V)30
Typical Turn-Off Delay Time (ns)30.6
Maximum Gate Threshold Voltage (V)2.7
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)28.2
Typical Input Capacitance @ Vds (pF)1799@15V
Maximum Drain-Source Resistance (mOhm)4.7@10V
Maximum Gate-Source Leakage Current (nA)100

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Packaging Process