10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

MACOM Technology Solutions CMPA2735030S

MACOM Technology Solutions CMPA2735030S electronic component product image

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Manufacturer No
CMPA2735030S
Availability
In Stock
Package
QFN EP
Description
RF Amp Single Power Amp 3.5GHz 50V 32-Pin QFN EP
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8542.33.00.01
PPAP
No
Type
Power Amplifier
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Pin Count
32
Automotive
No
Lead Shape
No Lead
PCB changed
32
Availability
No Stock Available
Package Width
5
Package Height
0.83
Package Length
5
Supplier Package
QFN EP
Power Supply Type
Single
Standard Package Name
QFN
Typical Power Gain (dB)
33.4@3500MHz
Typical Output Power (dBm)
44.44@3500MHz
Number of Channels per Chip
1
Maximum Input Return Loss (dB)
-27(Typ)@3500MHz
Maximum Output Return Loss (dB)
-16.5(Typ)@3500MHz
Maximum Operating Frequency (MHz)
3500
Maximum Operating Temperature (°C)
225(Typ)
Maximum Operating Supply Voltage (V)
50
AttributeValue
HTS8542.33.00.01
PPAPNo
TypePower Amplifier
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
Pin Count32
AutomotiveNo
Lead ShapeNo Lead
PCB changed32
AvailabilityNo Stock Available
Package Width5
Package Height0.83
Package Length5
Supplier PackageQFN EP
Power Supply TypeSingle
Standard Package NameQFN
Typical Power Gain (dB)33.4@3500MHz
Typical Output Power (dBm)44.44@3500MHz
Number of Channels per Chip1
Maximum Input Return Loss (dB)-27(Typ)@3500MHz
Maximum Output Return Loss (dB)-16.5(Typ)@3500MHz
Maximum Operating Frequency (MHz)3500
Maximum Operating Temperature (°C)225(Typ)
Maximum Operating Supply Voltage (V)50

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process