10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Littelfuse Inc. SP1011-04UTG

Littelfuse Inc. SP1011-04UTG electronic component product image

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Manufacturer
Manufacturer No
SP1011-04UTG
Quantity
3
Availability
In Stock
Package
6-XDFN
Packaging
Tape & Reel (TR)
Description
TVS DIODE 6VWM 10.2VC 6UDFN
Detailed Description
10.2V Clamp 2A (8/20µs) Ipp Tvs Diode Surface Mount 6-µDFN (1.25x1.0)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Littelfuse Inc.
Type
Zener
Series
SP1011, SPA®
Packaging
Tape & Reel (TR)
Applications
General Purpose
Mounting Type
Surface Mount
Package / Case
6-XDFN
Power - Peak Pulse
-
Operating Temperature
-40°C ~ 125°C (TJ)
Power Line Protection
No
Capacitance @ Frequency
-
Supplier Device Package
6-µDFN (1.25x1.0)
Unidirectional Channels
4
Voltage - Breakdown (Min)
7V
Voltage - Clamping (Max) @ Ipp
10.2V
Voltage - Reverse Standoff (Typ)
6V (Max)
Current - Peak Pulse (10/1000µs)
2A (8/20µs)
AttributeValue
MfrLittelfuse Inc.
TypeZener
SeriesSP1011, SPA®
PackagingTape & Reel (TR)
ApplicationsGeneral Purpose
Mounting TypeSurface Mount
Package / Case6-XDFN
Power - Peak Pulse-
Operating Temperature-40°C ~ 125°C (TJ)
Power Line ProtectionNo
Capacitance @ Frequency-
Supplier Device Package6-µDFN (1.25x1.0)
Unidirectional Channels4
Voltage - Breakdown (Min)7V
Voltage - Clamping (Max) @ Ipp10.2V
Voltage - Reverse Standoff (Typ)6V (Max)
Current - Peak Pulse (10/1000µs)2A (8/20µs)

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Packaging Process