Littelfuse Inc. LDA100S
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8541.49.80.00 |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tube |
| Pin Count | 6 |
| Standards | CSA|EN|IEC|TUV|UL |
| Automotive | No |
| Input Type | AC |
| Lead Shape | Gull-wing |
| Output Type | DC |
| PCB changed | 6 |
| Availability | No Stock Available |
| Output Device | Transistor With Base |
| Package Width | 6.35 |
| Package Height | 3.3 |
| Package Length | 8.38 |
| Supplier Package | PDIP SMD |
| Standard Package Name | DIP |
| Manufacturer Lead Time | 26 weeks |
| Maximum Forward Voltage (V) | 1.4 |
| Minimum Forward Voltage (V) | 0.9 |
| Number of Channels per Chip | 1 |
| Typical Forward Voltage (V) | 1.2 |
| Maximum Forward Current (mA) | 50 |
| Maximum Power Dissipation (mW) | 150 |
| Minimum Isolation Voltage (Vrms) | 3750 |
| Maximum Current Transfer Ratio (%) | 300(Typ) |
| Minimum Current Transfer Ratio (%) | 33 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Collector-Emitter Voltage (V) | 30 |
| Current Transfer Ratio Test Current (mA) | 1 |
| Maximum Collector-Emitter Saturation Voltage (mV) | 500 |
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Packaging Process
