10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Littelfuse Inc. IXGN320N60A3

Littelfuse Inc. IXGN320N60A3 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
IXGN320N60A3
Quantity
8
Availability
In Stock
Package
SOT-227B
Description
Trans IGBT Chip N-CH 600V 320A 735W 4-Pin SOT-227B
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8541.29.00.55
PPAP
No
SVHC
Yes
EU RoHS
Compliant with Exemption
Mounting
Screw
ECCN (US)
EAR99
Pin Count
4
Automotive
No
PCB changed
4
Availability
No Stock Available
Channel Type
N
Configuration
Single Dual Emitter
Package Width
25.42(Max)
Package Length
38.23(Max)
Supplier Package
SOT-227B
Standard Package Name
SOT
Manufacturer Lead Time
31 weeks
SVHC Exceeds Threshold
Yes
Maximum Power Dissipation (mW)
735
Maximum Gate Emitter Voltage (V)
±20
Maximum Operating Temperature (°C)
150
Minimum Operating Temperature (°C)
-55
Maximum Collector-Emitter Voltage (V)
600
Maximum Gate Emitter Leakage Current (uA)
150
Maximum Continuous DC Collector Current (A)
320
Typical Collector-Emitter Saturation Voltage (V)
1.46
AttributeValue
HTS8541.29.00.55
PPAPNo
SVHCYes
EU RoHSCompliant with Exemption
MountingScrew
ECCN (US)EAR99
Pin Count4
AutomotiveNo
PCB changed4
AvailabilityNo Stock Available
Channel TypeN
ConfigurationSingle Dual Emitter
Package Width25.42(Max)
Package Length38.23(Max)
Supplier PackageSOT-227B
Standard Package NameSOT
Manufacturer Lead Time31 weeks
SVHC Exceeds ThresholdYes
Maximum Power Dissipation (mW)735
Maximum Gate Emitter Voltage (V)±20
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-55
Maximum Collector-Emitter Voltage (V)600
Maximum Gate Emitter Leakage Current (uA)150
Maximum Continuous DC Collector Current (A)320
Typical Collector-Emitter Saturation Voltage (V)1.46

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Packaging Process