10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

LAPP 44424031

LAPP 44424031 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
44424031
Packaging
Box
Description
MODULAR MC MCB HHC1
Detailed Description
Female Insert Gray 1 Position Crimp
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Size
-
Color
Gray
Gender
Female
Series
MC
Packaging
Box
Contact Type
-
Manufacturer
LAPP
Connector Type
Insert
Contact Finish
-
Voltage Rating
600V
Contact Material
-
Housing Material
Polyamide (PA), Nylon
Termination Style
Crimp
Number of Positions
1
Current Rating (Amps)
320A
Operating Temperature
-40°C ~ 125°C
Material Flammability Rating
-
AttributeValue
Size-
ColorGray
GenderFemale
SeriesMC
PackagingBox
Contact Type-
ManufacturerLAPP
Connector TypeInsert
Contact Finish-
Voltage Rating600V
Contact Material-
Housing MaterialPolyamide (PA), Nylon
Termination StyleCrimp
Number of Positions1
Current Rating (Amps)320A
Operating Temperature-40°C ~ 125°C
Material Flammability Rating-

Purchase & Inquiry

Placing an Order

You can place an order with FIXCHIPS without having to register or create an account.

Payment Options

To make payment more convenient, we support multiple payment methods in USD, including PayPal, credit cards, and wire transfer.

RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process