10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

KEMET L0805C1R8KSMST

KEMET L0805C1R8KSMST electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
L0805C1R8KSMST
Availability
In Stock
Package
0805 (2012 Metric)
Packaging
Tape & Reel (TR)
Description
FIXED IND 1.8UH 50MA 600 MOHM
Detailed Description
1.8 µH Shielded Multilayer Inductor 50 mA 600mOhm Max 0805 (2012 Metric)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
KEMET
Type
Multilayer
Series
L-SMS
Ratings
-
Features
-
Q @ Freq
45 @ 10MHz
Packaging
Tape & Reel (TR)
Shielding
Shielded
Tolerance
±10%
Inductance
1.8 µH
Mounting Type
Surface Mount
Package / Case
0805 (2012 Metric)
Material - Core
Ferrite
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Base Product Number
L0805C
DC Resistance (DCR)
600mOhm Max
Current Rating (Amps)
50 mA
Height - Seated (Max)
0.041" (1.05mm)
Operating Temperature
-40°C ~ 85°C
Supplier Device Package
0805 (2125 Metric)
Frequency - Self Resonant
55MHz
Current - Saturation (Isat)
-
Inductance Frequency - Test
10 MHz
AttributeValue
MfrKEMET
TypeMultilayer
SeriesL-SMS
Ratings-
Features-
Q @ Freq45 @ 10MHz
PackagingTape & Reel (TR)
ShieldingShielded
Tolerance±10%
Inductance1.8 µH
Mounting TypeSurface Mount
Package / Case0805 (2012 Metric)
Material - CoreFerrite
Size / Dimension0.079" L x 0.049" W (2.00mm x 1.25mm)
Base Product NumberL0805C
DC Resistance (DCR)600mOhm Max
Current Rating (Amps)50 mA
Height - Seated (Max)0.041" (1.05mm)
Operating Temperature-40°C ~ 85°C
Supplier Device Package0805 (2125 Metric)
Frequency - Self Resonant55MHz
Current - Saturation (Isat)-
Inductance Frequency - Test10 MHz

Purchase & Inquiry

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process