10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

IXYS IXTY02N120PTRL

IXYS IXTY02N120PTRL electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
IXTY02N120PTRL
Package
DPAK
Packaging
Tape and Reel
Description
Trans MOSFET N-CH 1.2KV 0.2A 3-Pin(2+Tab) DPAK T/R
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8541.29.00.95
Tab
Tab
PPAP
No
SVHC
Yes
EU RoHS
Compliant with Exemption
Category
Power MOSFET
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Pin Count
3
Automotive
No
PCB changed
2
Availability
No Stock Available
Channel Mode
Enhancement
Channel Type
N
Configuration
Single
Package Width
6.22(Max) mm
Package Height
2.4(Max) mm
Package Length
6.73(Max) mm
Supplier Package
DPAK
Standard Package Name
TO
SVHC Exceeds Threshold
Yes
Typical Fall Time (ns)
39
Typical Rise Time (ns)
10
Number of Elements per Chip
1
Maximum Power Dissipation (mW)
33000
Typical Gate Charge @ 10V (nC)
4.7
Typical Gate Charge @ Vgs (nC)
4.7@10V
Maximum Gate-Source Voltage (V)
±20
Typical Turn-On Delay Time (ns)
6
Maximum Drain-Source Voltage (V)
1200
Typical Turn-Off Delay Time (ns)
21
Maximum Operating Temperature (°C)
150
Minimum Operating Temperature (°C)
-55
Maximum Continuous Drain Current (A)
0.2
Typical Input Capacitance @ Vds (pF)
104@25V
Maximum Drain-Source Resistance (mOhm)
75000@10V
AttributeValue
HTS8541.29.00.95
TabTab
PPAPNo
SVHCYes
EU RoHSCompliant with Exemption
CategoryPower MOSFET
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count3
AutomotiveNo
PCB changed2
AvailabilityNo Stock Available
Channel ModeEnhancement
Channel TypeN
ConfigurationSingle
Package Width6.22(Max) mm
Package Height2.4(Max) mm
Package Length6.73(Max) mm
Supplier PackageDPAK
Standard Package NameTO
SVHC Exceeds ThresholdYes
Typical Fall Time (ns)39
Typical Rise Time (ns)10
Number of Elements per Chip1
Maximum Power Dissipation (mW)33000
Typical Gate Charge @ 10V (nC)4.7
Typical Gate Charge @ Vgs (nC)4.7@10V
Maximum Gate-Source Voltage (V)±20
Typical Turn-On Delay Time (ns)6
Maximum Drain-Source Voltage (V)1200
Typical Turn-Off Delay Time (ns)21
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)0.2
Typical Input Capacitance @ Vds (pF)104@25V
Maximum Drain-Source Resistance (mOhm)75000@10V

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Packaging Process