Inventchip IV1D12020T3

Inventchip IV1D12020T3 electronic component product image

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Manufacturer
Manufacturer No
IV1D12020T3
Package
TO-247-3
Packaging
Tube
Description
DIODE ARR SIC 1200V 30A TO247-3
Detailed Description
Diode Array 1 Pair Common Cathode 1200 V 30A (DC) Through Hole TO-247-3
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
No Recovery Time > 500mA (Io)
Series
-
Packaging
Tube
Technology
SiC (Silicon Carbide) Schottky
Manufacturer
Inventchip
Mounting Type
Through Hole
Package / Case
TO-247-3
Diode Configuration
1 Pair Common Cathode
Supplier Device Package
TO-247-3
Reverse Recovery Time (trr)
0 ns
Current - Reverse Leakage @ Vr
100 µA @ 1200 V
Voltage - DC Reverse (Vr) (Max)
1200 V
Operating Temperature - Junction
-55°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If
1.8 V @ 20 A
Current - Average Rectified (Io) (per Diode)
30A (DC)
AttributeValue
SpeedNo Recovery Time > 500mA (Io)
Series-
PackagingTube
TechnologySiC (Silicon Carbide) Schottky
ManufacturerInventchip
Mounting TypeThrough Hole
Package / CaseTO-247-3
Diode Configuration1 Pair Common Cathode
Supplier Device PackageTO-247-3
Reverse Recovery Time (trr)0 ns
Current - Reverse Leakage @ Vr100 µA @ 1200 V
Voltage - DC Reverse (Vr) (Max)1200 V
Operating Temperature - Junction-55°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If1.8 V @ 20 A
Current - Average Rectified (Io) (per Diode)30A (DC)

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping