10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Integrated Silicon Solution Inc IS29GL128-70DLET

Integrated Silicon Solution Inc IS29GL128-70DLET electronic component product image

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Manufacturer No
IS29GL128-70DLET
Date Code
25+
Quantity
580
Availability
In Stock
Package
LFBGA
Description
NOR Flash Parallel 3V/3.3V 128M-bit 16M x 8/8M x 16 70ns 64-Pin LFBGA
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8542.32.00.71
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
Cell Type
NOR
ECCN (US)
3A991.b.1.a
Page Size
8Words/16byte
Pin Count
64
Automotive
No
Boot Block
Yes
Lead Shape
Ball
ECC Support
No
PCB changed
64
Sector Size
128Kbyte x 128
Timing Type
Asynchronous
Architecture
Sectored
Availability
No Stock Available
Package Width
9
Interface Type
Parallel
Package Height
0.8(Max)
Package Length
9
Number of Words
16M/8M
Programmability
Yes
Supplier Package
LFBGA
Block Organization
Symmetrical
Chip Density (bit)
128M
Command Compatible
Yes
Process Technology
65nm
Address Width (bit)
25/24
OE Access Time (ns)
35
Program Current (mA)
40
Support of Page Mode
Yes
Max. Access Time (ns)
70
Standard Package Name
BGA
Location of Boot Block
Bottom|Top
Manufacturer Lead Time
24 weeks
Maximum Erase Time (s)
150/Chip
Operating Current (mA)
45
Page Read Current (mA)
15
Programming Voltage (V)
2.7 to 3.6
Number of Bits/Word (bit)
8/16
Supplier Temperature Grade
Extended
Maximum Page Access Time (ns)
20
Maximum Programming Time (ms)
0.2/Byte
Maximum Operating Temperature (°C)
105
Minimum Operating Temperature (°C)
-40
Maximum Operating Supply Voltage (V)
3.6
Minimum Operating Supply Voltage (V)
3
Typical Operating Supply Voltage (V)
3|3.3
AttributeValue
HTS8542.32.00.71
PPAPNo
EU RoHSCompliant
MountingSurface Mount
Cell TypeNOR
ECCN (US)3A991.b.1.a
Page Size8Words/16byte
Pin Count64
AutomotiveNo
Boot BlockYes
Lead ShapeBall
ECC SupportNo
PCB changed64
Sector Size128Kbyte x 128
Timing TypeAsynchronous
ArchitectureSectored
AvailabilityNo Stock Available
Package Width9
Interface TypeParallel
Package Height0.8(Max)
Package Length9
Number of Words16M/8M
ProgrammabilityYes
Supplier PackageLFBGA
Block OrganizationSymmetrical
Chip Density (bit)128M
Command CompatibleYes
Process Technology65nm
Address Width (bit)25/24
OE Access Time (ns)35
Program Current (mA)40
Support of Page ModeYes
Max. Access Time (ns)70
Standard Package NameBGA
Location of Boot BlockBottom|Top
Manufacturer Lead Time24 weeks
Maximum Erase Time (s)150/Chip
Operating Current (mA)45
Page Read Current (mA)15
Programming Voltage (V)2.7 to 3.6
Number of Bits/Word (bit)8/16
Supplier Temperature GradeExtended
Maximum Page Access Time (ns)20
Maximum Programming Time (ms)0.2/Byte
Maximum Operating Temperature (°C)105
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)3
Typical Operating Supply Voltage (V)3|3.3

Purchase & Inquiry

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Payment Options

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RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process