Integrated Device Technology PS9303L2-V-E3-AX
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| Attribute | Value |
|---|---|
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| Polarity | Non-Inverting |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 6 |
| Standards | VDE|UL|EN|DIN|CSA |
| Automotive | No |
| Input Type | DC |
| Lead Shape | Gull-wing |
| Output Type | Totem-Pole |
| PCB changed | 6 |
| Availability | No Stock Available |
| Package Width | 6.8 |
| Direction Type | Uni-Directional |
| Package Height | 3.5 |
| Package Length | 4.58 |
| Supplier Package | DIP SMD |
| Maximum Data Rate | 1Mbps |
| Standard Package Name | DIP |
| Typical Fall Time (us) | 0.09 |
| Typical Rise Time (us) | 0.12 |
| Maximum Forward Voltage (V) | 1.9 |
| Maximum Reverse Voltage (V) | 5 |
| Minimum Forward Voltage (V) | 1.2 |
| Number of Channels per Chip | 1 |
| Typical Forward Voltage (V) | 1.6 |
| Maximum Forward Current (mA) | 20 |
| Maximum Power Dissipation (mW) | 210 |
| Minimum Isolation Voltage (Vrms) | 5000 |
| Maximum Operating Temperature (°C) | 100 |
| Maximum Propagation Delay Time (ns) | 550 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Continuous Output Current (mA) | 25 |
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Packaging Process
