Infineon Technologies XMC1302T038X0064ABXUMA3

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Manufacturer

Infineon Technologies

Manufacturer No

XMC1302T038X0064ABXUMA3

Package

38-TFSOP (0.173", 4.40mm Width)

Packaging

Tape & Reel (TR)

Description

IC MCU 32BIT 64KB 38TFSOP

Detailed Description

ARM® Cortex®-M0 XMC1000 Microcontroller IC 32-Bit 32MHz 64KB (64K x 8) FLASH PG-TSSOP-38-9

Payment

Delivery

Mfr

Infineon Technologies

Grade

-

Speed

32MHz

Series

XMC1000

RAM Size

16K x 8

Core Size

32-Bit

Packaging

Tape & Reel (TR)

EEPROM Size

-

Peripherals

Brown-out Detect/Reset, I2S, POR, PWM, WDT

Connectivity

I2C, LINbus, SPI, UART/USART

Mounting Type

Surface Mount

Number of I/O

26

Qualification

-

Core Processor

ARM® Cortex®-M0

Package / Case

38-TFSOP (0.173", 4.40mm Width)

Data Converters

A/D 16x12b

Oscillator Type

Internal

Base Product Number

MC1302T

Program Memory Size

64KB (64K x 8)

Program Memory Type

FLASH

Operating Temperature

-40°C ~ 105°C (TA)

Supplier Device Package

PG-TSSOP-38-9

Voltage - Supply (Vcc/Vdd)

1.8V ~ 5.5V

Attribute	Value
Mfr	Infineon Technologies
Grade	-
Speed	32MHz
Series	XMC1000
RAM Size	16K x 8
Core Size	32-Bit
Packaging	Tape & Reel (TR)
EEPROM Size	-
Peripherals	Brown-out Detect/Reset, I2S, POR, PWM, WDT
Connectivity	I2C, LINbus, SPI, UART/USART
Mounting Type	Surface Mount
Number of I/O	26
Qualification	-
Core Processor	ARM® Cortex®-M0
Package / Case	38-TFSOP (0.173", 4.40mm Width)
Data Converters	A/D 16x12b
Oscillator Type	Internal
Base Product Number	MC1302T
Program Memory Size	64KB (64K x 8)
Program Memory Type	FLASH
Operating Temperature	-40°C ~ 105°C (TA)
Supplier Device Package	PG-TSSOP-38-9
Voltage - Supply (Vcc/Vdd)	1.8V ~ 5.5V

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Packaging Process