10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Infineon Technologies SIDC08D65C8X1SA2

Infineon Technologies SIDC08D65C8X1SA2 electronic component product image

Image is only for reference

Manufacturer No
SIDC08D65C8X1SA2
Package
Die
Packaging
Wafer
Description
Diode Switching 650V 30A 2-Pin Die Wafer
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8541.10.00.40
PPAP
No
Type
Switching Diode
EU RoHS
Compliant
ECCN (US)
EAR99
Packaging
Wafer
Pin Count
2
Automotive
No
PCB changed
2
Availability
No Stock Available
Configuration
Single
Package Width
2.3
Package Length
3.46
Supplier Package
Die
Manufacturer Lead Time
20 weeks
Peak Reverse Current (uA)
0.36
Maximum Forward Voltage (V)
1.87
Maximum DC Reverse Voltage (V)
650
Maximum Operating Temperature (°C)
175
Minimum Operating Temperature (°C)
-40
Peak Reverse Repetitive Voltage (V)
650
Maximum Continuous Forward Current (A)
30(Typ)
AttributeValue
HTS8541.10.00.40
PPAPNo
TypeSwitching Diode
EU RoHSCompliant
ECCN (US)EAR99
PackagingWafer
Pin Count2
AutomotiveNo
PCB changed2
AvailabilityNo Stock Available
ConfigurationSingle
Package Width2.3
Package Length3.46
Supplier PackageDie
Manufacturer Lead Time20 weeks
Peak Reverse Current (uA)0.36
Maximum Forward Voltage (V)1.87
Maximum DC Reverse Voltage (V)650
Maximum Operating Temperature (°C)175
Minimum Operating Temperature (°C)-40
Peak Reverse Repetitive Voltage (V)650
Maximum Continuous Forward Current (A)30(Typ)

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Packaging Process