Infineon Technologies S25FL128SDSMFBG00
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8542.32.00.71 |
| PPAP | Unknown |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| Cell Type | NOR |
| ECCN (US) | 3A991b.1.a. |
| Packaging | Tray |
| Page Size | 256byte|512byte |
| Pin Count | 16 |
| Automotive | Yes |
| Boot Block | Yes |
| ECC Support | Yes |
| PCB changed | 16 |
| Sector Size | 64Kbyte x 256 |
| Timing Type | Synchronous |
| Architecture | Sectored |
| Availability | No Stock Available |
| Package Width | 7.5 |
| Interface Type | Serial (SPI, Dual SPI, Quad SPI) |
| Package Height | 2.55(Max) |
| Package Length | 10.3 |
| Number of Words | 128M/64M/32M |
| Programmability | Yes |
| Supplier Package | SOIC W |
| Block Organization | Symmetrical |
| Chip Density (bit) | 128M |
| Command Compatible | Yes |
| Process Technology | 65nm |
| Address Width (bit) | 32 |
| Program Current (mA) | 100 |
| Support of Page Mode | No |
| Max. Access Time (ns) | 14.5 |
| Standard Package Name | SO |
| Location of Boot Block | Bottom|Top |
| Manufacturer Lead Time | 19 weeks |
| Maximum Erase Time (s) | 165/Bulk |
| Operating Current (mA) | 100 |
| Programming Voltage (V) | 2.7 to 3.6 |
| Number of Bits/Word (bit) | 1/2/4 |
| Minimum Endurance (Cycles) | 100000 |
| Supplier Temperature Grade | Automotive |
| Maximum Programming Time (ms) | 0.75/Page |
| Maximum Operating Frequency (MHz) | 133 |
| Maximum Operating Temperature (°C) | 105 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3|3.3 |
Purchase & Inquiry
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Packaging Process
